BARCELONA, ESP – Earlier this week MediaTek announced a new entry in the Helio SoC line-up, the Helio P60. The P60 comes with a strategy change for MediaTek as the company is doubling down on the super-midrange “premium” category and expanding that range into multiple sub-tiers.
The strategy change comes from market and lack of success in the high-end Helio X series. Last year’s Helio X30 had only a few design wins and was relatively late to market. MediaTek seems to have had a string of bad luck with the X20 and X30 as both came on either problematic or very delayed manufacturing process nodes which lost them important design wins. As more vendors switch over to custom designs in the high-end and Qualcomm puts more pressure with competitive designs, MediaTek decided to put a hold on the X series for now and concentrate in the range where it is very successful, the P series.
The this new segmentation means that the P60 doesn’t position itself as direct successor to late last year’s P23 and P30 but rather as a tier above them, hence the naming scheme.
| MediaTek Current P-Series | |||
| SoC | Helio P23 | Helio P30 | Helio P60 |
| CPU | 4x Cortex A53 @ 2.3GHz 4x Cortex A53 @ 1.65GHz |
4x Cortex A53 @ 2.3GHz 4x Cortex A53 @ 1.65GHz |
4x Cortex A73 @ 2.0GHz 4x Cortex A53 @ 2.0GHz |
| GPU | Mali G71MP2 @ 770MHz | Mali G71MP2 @ 900MHz | Mali G72MP3 @ 800MHz |
| APU | - | 2x 140GMACs | |
| Memory | 1x 32bit LPDDR3 @ 933MHz 2x 16bit LPDDR4X @1500MHz |
2x 16bit LPDDR4X @ 1600MHz | 1x 32bit LPDDR3 @ 933MHz 2x 16bit LPDDR4X @ 1800MHz |
| ISP/Camera | 1x 24MP or 2x 13MP | 1x 25 MP or 2x 16MP | 1x 32MP or 2x 20+16MP |
| Encode/ Decode |
2160p30 H.264 | 2160p30 H.264 & HEVC | 2160p30 H.264 & HEVC |
| Integrated Modem | Category 6 DL = 300Mbps 3x20MHz CA, 64-QAM UL = 50Mbps 64-QAM |
Category 7/13 DL = 300Mbps 3x20MHz CA, 64-QAM UL = 150Mbps 2x20MHz CA,64-QAM |
Category 7/13 DL = 300Mbps 3x20MHz CA, 64-QAM UL = 150Mbps 2x20MHz CA,64-QAM |
| Mfc. Process | 16FFC | 16FFC | 12FFC |
The P60 is the first SoC in the P-lineup to employ “big” microarchitecture cores as it uses 4x Cortex A73 cores at up to 2.0GHz – a significant performance boost in performance over the P23 and P30’s A53 cores. The efficiency cores are naturally still Cortex A53’s and they run at the same 2.0GHz frequency as the performance cluster.
On the GPU side we see an update in the IP as MediaTek in turn transitions from G71 to G72. The P60 uses a G72MP3 running at up to 800MHz and promises a 25% gaming efficiency boost (at up to 70% higher GPU performance).
Snapdragon 660 vs Helio P60 vs Snapdragon 835 Thermal Comparison @ MWC2018
The P60 is the first mobile SoC to come manufactured on TSMC’s new 12nm 12FFC process node. 12FFC is a shrink of 16FFC and uses the same tools – it’s a cost effective alternative to the more expensive 10FF process which requires quad-patterning. While 12FFC does not quite achieve the die size reduction that 10FF would, it’s extremely competitive in terms of power characteristics and reaches near the same efficiency. I asked MediaTek about the company process roadmap plan and they will focus exclusively on 12FFC for 2018 and have no plans for further 10nm silicon. The next generation will jump directly to 7nm in mid 2019 (after other vendors) when mass production will have reached mature and cost-effective levels.
The P60 is the first SoC to bring dedicated neural network accelerators into the mid-range. MediaTek’s denomination for such IP is APU (AI Processing Unit) so that’s yet another term added to the varied basket of abbreviations from different companies. MediaTek wouldn’t disclose the IP provider but say’s it’s a dual-core implementation offering 2x140GMACs. MediaTek will offer a custom software stack called NeuroPilot which will be compatible with Google’s NN API and frameworks such as TensorFlow, TF Lite, Caffe and Caffe2.
The modem subsystem remains the same as on the Helio P30 – it supports LTE up to Category 7 with 3x20MHz CA and 300Mbps download speeds and Category 13 with 2x20MHz CA for up to 150Mbps upload speeds.
The Helio P60 is in production now and we should see consumer smartphones with the chipset available starting early Q2 2018.
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