At a news conference today, Intel has announced that its Rio Rancho campus in New Mexico will be getting an investment of $3.5 billion USD for an expansion of its current state-of-the-art facilities for the company to roll out its new Foveros packaging technology in volume for its own products as well as its customers. This comes on top of the $20 billion USD that Intel has committed to two new fabrication plants in its Ocotillo campus in Arizona for wafer production. In partnership with New Mexico state and local government, the new investment is expected to provide 1000 construction jobs over three years, 700 permanent technical positions at the company, and 3500 ancillary positions in the area when the facility is fully functional.
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