PCHardCores
Monday, 28 August 2017
Intel discusses EMIB technology - Multi-die CPUs incoming?
http://ift.tt/eA8V8J
Intel has an interesting alternative to silicon interposers for multi-die connectivity.
from Overclock3D.Net http://ift.tt/2xrsV5W
via
IFTTT
No comments:
Post a Comment
Newer Post
Older Post
Home
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment